HCPL-2611-020E Logic Output Optoisolator 10MBd Schottky Clamped 5000Vrms 15kV/µs

Features of LAE5UM-25F-7BG381E

* Higher Logic Density for Increased System Integration
 * 12K to 44K LUTs
 * 197 to 203 user programmable I/Os
* Embedded SERDES
 * 270 Mb/s, up to 3.2 Gb/s, SERDES interface (ECP5UM Automotive)
 * Supports eDP in RDR (1.62 Gb/s) and HDR(2.7 Gb/s)
 * Up to four channels per device: PCI Express,Ethernet (1GbE, XAUI, and SGMII,), and CPRI
* sysDSP™
 * Fully cascadable slice architecture
 * 12 to 160 slices for high performance multiply and accumulate
 * Powerful 54-bit ALU operations
 * Time Division Multiplexing MAC Sharing
 * Rounding and truncation
 * Each slice supports
 * Half 36 x 36, two 18 x 18 or four 9 x 9 multipliers
 * Advanced 18 x 36 MAC and 18 x 18 Multiply-Multiply-Accumulate (MMAC) operations
* Flexible Memory Resources
 * Up to 1.944 Mb sysMEM™ Embedded Block RAM (EBR)
 * 194K to 351K bits distributed RAM
* sysCLOCK Analog PLLs and DLLs
 * Four DLLs and four PLLs in LAE5-45; two DLLs and two PLLs in LAE5-25 and LAE5-12
* Pre-engineered Source Synchronous I/O
* DDR registers in I/O cells
 * Dedicated read/write levelling functionality
 * Dedicated gearing logic
 * Source synchronous standards support
 * ADC/DAC, 7:1 LVDS, XGMII
 * High Speed ADC/DAC devices
 * Dedicated DDR2/DDR3 and LPDDR2/LPDDR3 memory support with DQS logic, up to 800 Mb/s data-rate
* Programmable sysI/O™ Buffer Supports Wide
Range of Interfaces
 * On-chip termination
 * LVTTL and LVCMOS 33/25/18/15/12
 * SSTL 18/15 I, II
 * HSUL12
 * LVDS, Bus-LVDS, LVPECL, RSDS, MLVDS
 * subLVDS and SLVS, MIPI D-PHY input interfaces
* Flexible Device Configuration
 * Shared bank for configuration I/Os
 * SPI boot flash interface
 * Dual-boot images supported
 * Slave SPI
 * TransFR™ I/O for simple field updates
* Single Event Upset (SEU) Mitigation Support
 * Soft Error Detect – Embedded hard macro
 * Soft Error Correction – Without stopping user operation
 * Soft Error Injection – Emulate SEU event to debug system error handling
* System Level Support
 * IEEE 1149.1 and IEEE 1532 compliant
 * Reveal Logic Analyzer
 * On-chip oscillator for initialization and generaluse
 * 1.1 V core power supply

Descriptions of LAE5UM-25F-7BG381E

The ECP5 Automotive family of FPGA devices is optimized to deliver high performance features such as
an enhanced DSP architecture, high speed SERDES and high speed source synchronous interfaces in an
economical FPGA fabric.

Environmental & Export Classifications of LAE5UM-25F-7BG381E

Shenzhen Swift Automation Technology Co., Ltd. is located in the BaoAn District of Shenzhen City,12 KM to the Shenzhen Airport and near the New Convention and exhibition center. Our business majorly covers 2 aspects:

1. Automatic Nylon Cable Tie machine and its supporting equipments.
2. Nylon Cable Ties.

We have a very strong design team, most of the engineers graduated from the renowned military institution, such as HIT,Beijing Institute of Technology, Shenyang Aerospace University, worked as weapon designer for many years, and got trained and worked in Switzerland, Germany, Austria, and Czech Republicas for auomation design for years; Served as senior engineer and senior engineering manager in a number of large multinational enterprises (Vitech, Microsoft, Foxconn, Flextronics, TE, Whirlpool, etc.). Most of our assembly engineers come from丿apanese automation companies. Obtained European design conception and skill, with Japanese quality sense to control the manufacturing process, we can provide you the best technical solution and reliable product quality.
SWIFT--- will be becoming the world's top brand of nylon cable tie and the tools maker, with more than 50 inventions patents as well as multiple software Copyrights. Not only in dominant position in China market, our products have been sold to more than 30 countries and regions (such as United States, Netherlands, Mexico, Japan, South Korea, Turkey, Romania, Italy ... highly developed countries}, with nearly 400 customers in worldwide.

Our target: Internationalization, branding, specialization .

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